In 2022, ASML made significant progress, such as in DUV with the delivery of the first NXT KrF unit, TWINSCAN NXT:870, and the first TWINSCAN NXT:2100i. At present, ASML continues to research and develop the next generation EUV lithography machine, High NA EUV lithography machine.

According to ASML, in 2022, after six years of development, they received the first high numerical aperture mechanical projection optical device and illuminator from a supplier, as well as a new wafer stage. These modules are an important step in the initial testing and integration of EXE:5000.

ASML said that in 2022 the company received purchase orders from all existing EUV customers for the delivery of the industry's first TWINSCAN EXE:5200 System -- a high-volume EUV production system with High-NA and a productivity of 220 wafers per hour.

As for the future path of EUV lithography, Martin van den Brink, ASML's chief technology officer, revealed in the earnings release that he believes Hyper-NA EUV could become a reality by the end of this decade, with customers working on it between 2024 and 2025. It is expected to go into mass production between 2025 and 2026. High-NA lithographers are known to make smaller CDS at key layers.

High-NA lithographers are known to be able to make smaller CDS at key layers, but are now facing significant challenges with developers. "The biggest challenge in developing High-NA technology is building metering tools for EUV optics. The High-NA mirror is twice the size of its predecessor and needs to be flat within 20 pimmeters. To do that, you need to do it in a vacuum container so big 'you can fit half the company in there.'" Martin van den Brink said.