Texas Instruments (TI) announced on February 15 that it will build a second 300mm wafer plant in Lehi, Utah. Texas Instruments plans to build a second 300mm semiconductor wafer manufacturing facility in Lee Hay, Utah, as part of its $11 billion investment in the state.

The new facility will be located next to Texas Instruments' existing LFAB facility for 300mm semiconductor wafers, and when the second facility is completed, it will be combined with the existing facility and eventually operate as a single facility. The new fab will create about 800 additional jobs for Texas Instruments, as well as thousands of indirect jobs.

Construction of the new plant is expected to begin in the second half of 2023 and production could begin as early as 2026. The cost of the new facility is included in TI's previously announced capital expenditure plan to expand its manufacturing capacity and will form complementary fabs with TI's existing 300mm fabs.

Texas Instruments acquired LFAB, a 12-inch fab in Lee Hai, in 2021 and will begin production in late 2022. It will support 65nm and 45nm production technology to manufacture analog and embedded processing chips for renewable energy, electric vehicles, space telescopes and other applications. Ti's investment in Li Hai's LFAB facility will be about $3 billion to $4 billion, according to the company's website.