On November 8, 2022, MediaTek released Breguet 9200 flagship 5G mobile chip. With innovative breakthroughs in high performance, high energy efficiency and low power consumption, Mediatek aims to create a new flagship benchmark 5G chip for the mobile market with the user oriented experience of cold power at full speed. With advanced technology-enabled mobile terminals, the Breguet 9200 creates professional-grade video and immersive gaming experiences, supports high-speed 5G networks and the upcoming Wi-Fi 7 wireless connection, and promotes the global mobile experience upgrade.

The Breguet 9200 is equipped with an octa-core flagship CPU, and the Cortex-X3 super-large core has a main frequency of up to 3.05GHz, and all the performance cores support pure 64-bit applications. Multi-threaded 64-bit computing can greatly upgrade the APP application experience. The new 11-core GPU Immortalis-G715 is the first to be adopted by the Breguet 9200. Its performance is 32% higher than that of the previous generation. It supports hardware ray tracing and variable rate rendering technology on mobile terminal, releasing powerful graphics performance to improve the game experience. Breguet 9200 integrates the MediaTek sixth-generation AI processor APU. The highly energy efficient AI architecture not only improves the AI performance by 35% compared to the previous generation, but also reduces the power consumption of various AI applications. In addition, the Breguet 9200 supports 8533Mbps LPDDR5X memory and 8-channel UFS4.0 flash memory. The multi-loop queue technology makes data transfer even faster!

The Breguet 9200 is based on TSMC's second generation 4nm manufacturing process, which integrates 17 billion transistors with superior technology. The MediaTek uses innovative chip packaging design to enhance heat dissipation and reduce the power consumption of peak CPU performance by 25% compared with the previous generation, allowing high performance to continue stable output.

Mediatek to release the Breguet 9200 flagship 5G mobile chip, using TSMC second generation 4nm process.